E-learning course from 15 December 2017, Intensive training week 29 January – 2 February 201, Bern University of Applied Sciences Biel, Switzerland
The programme is part of the CAS Wood-Based Panels. It consists of an e-learning course and an intensive training course in Switzerland, aiming to give a short overview of the topics and to provide some foreknowledge for the participants that are not intensively working in specific fields of study. The e-learning course starts in December 2017, followed up by the intensive training week that takes place in Biel, in January 2018.
The programme provides an overview of the relationships between wood raw materials, adhesives, manufacturing procedures and properties of wood-based panels. It focuses closely on the issue of formaldehyde and VOC emissions from wood-based materials as well as on the interaction between adhesives and emissions. Its aim is to provide the participants with expert knowledge on the relationship between adhesive formulation, production parameters and resulting material emissions. Interesting new technologies aiming at reducing or replacing formaldehyde will be also discussed. During the training week in Biel, the participants will have regular experience exchange and discussion with experts in the field of adhesive and emission. They will also have an opportunity to visit the companies that are closely related to the topic. The course is an extraordinary networking possibility as the hosted guests are related to the production of wood-based panels from all around the world.
This module is part of the CAS Wood-Based Panels programme, but can also be attended separately.
The training programme is geared to the needs of professionals from the wood panels industry and related sectors such as executive staff, wood and material technologists, research staff.
Head of Course:
Dr. Frédéric Pichelin, Professor of adhesive technology
Bern University of Applied Sciences Architecture, Wood and Civil Engineering, Biel
Registration deadline: 11 December 2017
More info: Module flyer